
This course
is typically offered in the FALL.
This is a related course of the MOT program.
This course emphasizes the physical principles and mathematical models used in microfabrication technology. It begins with a brief overview of the CMOS fabrication process flow, its key technology elements, and the issues that limit these processes. We then cover the front-end processes: mechanisms and models for implantation, oxidation and diffusion. Advanced models for optical image formation, resist response, defect printability, inspection and next generation electron-beam and exposures systems. Back end of the line processes include etching, physical and chemical deposition processes, CMP, and multilevel metallization. Extension of these process modules for displays, MEMS, and Nanotechnology will be discussed. The last 3 weeks cover basic statistical process control (SPC) and design of experiments (DOE) as used to support high yield manufacturing.
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